The barrel-shaped body of the pad is formed when the board is drilled and through-plated during fabrication. Pads can exist on a single layer, for example, as a Surface Mount Device pad, or they can be a three-dimensional through-hole pad, having a barrel-shaped body in the Z-plane (vertical) with a flat area on each (horizontal) copper layer. Pads are used for fixing the component to the board and for creating the interconnection points from the component pins to the routing on the board. Pads are used to provide both mechanical mounting and electrical connections to the component pinsĪ pad is a primitive design object. Parent page: PCB Placement & Editing Techniques Pad and Via Summary Controlling the Via Placed during Interactive Routing.Via Placement during Interactive Routing.
Configuring the Routing Via Style Design Rule.Non-Graphical Editing via the Properties Panel.
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